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PPTC SMD0805贴片保险丝

  • 发布时间:2019-11-12 13:21
  • 作者:梁行
  • 阅读:
  • PFP

    产品型号:PPTC SMD0805贴片保险丝

    产品尺寸:2.0mmx 1.2mm
    额定电流:100mA~1A
    额定电压:6V~15V
    温度范围:-45℃to+85℃
    安规认证:

     

     

    Part

    Number

    Hold

    Current

    Trip

    Current

    Rated

    Voltage

    Max

    Current

    Typical

    Power

    Max Time to Trip

    Resistance Tolerance

    Current

    Time

    RMIN

    R1MAX

    IH, A

    IT, A

    VMAX, Vdc

    IMAX, A

    Pd, W

    Amp

    Sec

    Ω

    Ω

    FSMD010-0805-R

    0.10

    0.30

    15

    100

    0.5

    0.50

    1.50

    0.700

    6.000

    FSMD020-0805-R

    0.20

    0.50

    9

    100

    0.5

    8.00

    0.02

    0.400

    3.500

    FSMD035-0805-R

    0.35

    0.75

    6

    100

    0.5

    8.00

    0.10

    0.250

    1.200

    FSMD050-0805R

    0.50

    1.00

    6

    100

    0.5

    8.00

    0.10

    0.150

    0.850

    FSMD050-9-0805R

    0.50

    1.00

    6

    100

    0.5

    8.00

    0.10

    0.150

    0.850

    FSMD075-0805R

    0.75

    1.50

    6

    40

    0.6

    8.00

    0.20

    0.090

    0.350

    FSMD100-0805R

    1.00

    1.95

    6

    40

    0.6

    8.00

    0.30

    0.060

    0.210

    IH=Hold current-maximum current at which the device will not trip at 23℃still air.
    IT=Trip current-minimum current at which the device will always trip at 23℃ still air.
    V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX)
    I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX).
    Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment.
    RMIN=Minimum device resistance at 23℃ prior to tripping.
    R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds.
    Termination pad characteristics
    Termination pad materials: Pure Tin

    SMD0805Product Dimensions (Millimeters)

     

    Part

    Number

    A

    B

    C

    D

    E

    Min

    Max

    Min

    Max

    Min

    Max

    Min

    Max

    Min

    Max

    FSMD010-0805-R

    2.00

    2.30

    1.20

    1.50

    0.30

    1.00

    0.20

    0.60

    0.10

    0.45

    FSMD020-0805-R

    2.00

    2.30

    1.20

    1.50

    0.30

    1.00

    0.20

    0.60

    0.10

    0.45

    FSMD035-0805-R

    2.00

    2.30

    1.20

    1.50

    0.25

    0.75

    0.20

    0.60

    0.10

    0.45

    FSMD050-0805R

    2.00

    2.20

    1.20

    1.50

    0.55

    1.25

    0.20

    0.60

    0.10

    0.45

    FSMD050-9-0805R

    2.00

    2.20

    1.20

    1.50

    0.55

    1.25

    0.20

    0.60

    0.10

    0.45

    FSMD075-0805R

    2.00

    2.20

    1.20

    1.50

    0.55

    1.25

    0.20

    0.60

    0.10

    0.45

    FSMD100-0805R

    2.00

    2.20

    1.20

    1.50

    0.75

    1.80

    0.20

    0.60

    0.10

    0.45

    Thermal Derating Curve

    Typical Time-To-Trip at 23℃

    Standard Pavkage

    P/N

    Pcs /Bag

    Reel/Tape

    SMD010-0805-R

    -----

    4K

    SMD020-0805-R

    -----

    4K

    SMD035-0805-R

    -----

    4K

    SMD050-0805R

    -----

    3K

    SMD050-9-0805R

    -----

    3K

    SMD075-0805R

    -----

    3K

    SMD100-0805R

    -----

    3K

    Warning:

    1 Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.

    2 PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated.

    3 Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.

    Pad Layouts, Solder Reflow and Rework Recommendations
    The dimension in the table below provide the recommended pad layout for each FSMD1812 device

    Pad dimensions (millimeters)

    Device

    A

    B

    C

    Nominal

    Nominal

    Nominal

    All 0805 Series

    1.20

    1.00

    1.50

    Solder reflow

    Profile Feature

    Pb-Free Assembly

    Average Ramp-Up Rate (Tsmax to Tp)

    3 ℃/second max.

    Preheat :

    Temperature Min (Tsmin)

    Temperature Max (Tsmax)

    Time (tsmin to tsmax)

    150 ℃

    200 ℃

    60-180 seconds

    Time maintained above:

    Temperature(TL)

    Time (tL)

    217 ℃

    60-150 seconds

    Peak/Classification Temperature(Tp) :

    260 ℃

    Time within 5℃ of actual Peak :

    Temperature (tp)

    20-40 seconds

    Ramp-Down Rate :

    6 ℃/second max.

    Time 25 ℃ to Peak Temperature :

    8 minutes max.

    Note 1: All temperatures refer to of the package,

    measured on the package body surface.


    Solder reflow

    ※ Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.

    1. Recommended max past thickness > 0.25mm.

    2. Devices can be cleaned using standard methods and aqueous solvent.

    3. Rework use standard industry practices.

    4. Storage Environment : < 30℃ / 60%RH

    Caution:

    1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

    2. Devices are not designed to be wave soldered to the bottom side of the board.


    • VF451/VF453 RoHS

      VF451/VF453 RoHS

    • VF452/VF454 RoHS

      VF452/VF454 RoHS

    • CF0402

      CF0402

    • CFS0402

      CFS0402

    • CP0402

      CP0402

    • CF0603

      CF0603

    • CFS0603

      CFS0603

    • CP0603

      CP0603

    • CPS0603

      CPS0603

    • CF1206

      CF1206

    • CFS1206

      CFS1206

    • CP1206

      CP1206

    • CPS1206

      CPS1206

    • PPTC SMD0603

      PPTC SMD0603

    • PPTC SMD0805

      PPTC SMD0805

    • PPTC SMD1210

      PPTC SMD1210

    • PPTC SMD1812